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Shenzhen Huafu Fast Multilayer Circuit Co. LTD
Shenzhen Huafu Fast Multilayer Circuit Co. LTD
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OSP 22F Fiberglass Small Batch Assembly Printed Circuit Assy

Shenzhen Huafu Fast Multilayer Circuit Co. LTD
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OSP 22F Fiberglass Small Batch Assembly Printed Circuit Assy

Brand Name : HF

Model Number : Single Sided PCB Board

Certification : ISO CE

Place of Origin : China

MOQ : 5PCS

Price : Negotiable

Delivery Time : 5~8 days

Packaging Details : box

Payment Terms : L/C, T/T,PAYPAL

material : 22F

layer count : 1

board thickness : 1.0

copper thickness : 1oz

solder color : green

silkscreen colr : white

surface finishing : osp

service : One Stop Turnkey service

Layer Coun : 1-40

Solder Mask color : green, yellow,white, blue,black,red

Silkscreen Color : white black

Test : 100% AOI, X-ray, Flying probe test.

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Application
Products are applied to a wide range of High-tech industries such as: LED, telecommunication, computer application, lighting, game machine, industrial control, power, automobile and high-end consumer electronics, ect. By unremitting work and effort to the marketing, products exports to American, Canada, Europe counties, Africa and other Asia-pacific countries

Capability

 High precision prototypePCB bulk production
Max Layers1-28 layers1-14 layers
MIN Line width(mil)3mil4mil
MIN Line space(mil)3mil4mil
Min via (mechanical drilling)Board thickness≤1.2mm0.15mm0.2mm
Board thickness≤2.5mm0.2mm0.3mm
Board thickness>2.5mmAspect Ration≤13:1Aspect Ration≤13:1
Aspect RationAspect Ration≤13:1Aspect Ration≤13:1
Board thicknessMAX8mm7mm
MIN2 layers:0.2mm;4 layers:0.35mm;6 layers:0.55mm;8 layers:0.7mm;10 layers:0.9mm2 layers:0.2mm;4 layers:0.4mm;6 layers:0.6mm;8layers:0.8mm
MAX Board size610*1200mm610*1200mm
Max copper thickness0.5-6oz0.5-6oz
Immersion Gold/
Gold Plated Thickness
Immersion Gold:Au,1—8u”
Gold finger:Au,1—150u”
Gold Plated:Au,1—150u”
Nickel Plated :50—500u”
 
Hole copper thick25um 1mil25um 1mil
ToleranceBoard thicknessBoard thickness≤1.0mm:+/-0.1mm
1.0mm<Board thickness≤2.0mm:+/-10%
Board thickness>2.0mm:+/-8%
Board thickness≤1.0mm:+/-0.1mm
1.0mm<Board thickness≤2.0mm:+/-10%
Board thickness>2.0mm:+/-8%
Outline Tolerance≤100mm:+/-0.1mm
100< ≤300mm:+/-0.15mm
>300mm:+/-0.2mm
≤100mm:+/-0.13mm
100< ≤300mm:+/-0.15mm
>300mm:+/-0.2mm
Impedance±10%±10%
MIN Solder mask bridge 0.08mm 0.10mm
Plugging Vias capability 0.25mm--0.60mm 0.70mm--1.00mm


Advantages
1. PCB factory directly
2. Comprehensive quality control system
3. Competitive price
4. Quick turn delivery time from 48hours.
5. Certificates (ISO/UL E354810/RoHS)
6. 9 years experience in exporting service
7. No MOQ/MOV.
8. High quality. Strict through the AOI(Automated Optical Inspection), QA/QC, flying porbe ,Etesting, etc


OSP 22F Fiberglass Small Batch Assembly Printed Circuit AssyOSP 22F Fiberglass Small Batch Assembly Printed Circuit AssyOSP 22F Fiberglass Small Batch Assembly Printed Circuit AssyOSP 22F Fiberglass Small Batch Assembly Printed Circuit AssyOSP 22F Fiberglass Small Batch Assembly Printed Circuit Assy


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